ESTABLISHMENT OF AN MODELLING AND ANALYSIS SISTEM IN THE FIELD OF ELECTRONIC PACKAGING
DIRECTOR of the PROJECT
ALLOCATED VALUE (USD)
IONESCU CIPRIAN
20000
Description of the project: "THE GOAL OF THE PRESENT RESEARCH PROJECT IS TO SIMULATE ON AN ADVANCED THEORETICAL BASIS THE ELECTRICAL AND THERMAL PHENOMENA EXISTING IN ELECTRONIC PACKAGING. THIS APPROACH, APPLIED TO PACKAGING HAS AS A NOVELTY THE CONSIDERATION OF THE INTERACTIONS BETWEEN THE ELECTRICAL AND THERMAL ELEMENTS, OR OTHER SAYING, THE COUPLED ELECTRICAL-THERMAL FIELDS. AS RESULT, THE ANALYSIS ON A MODEL WILL BE CLOSER TO REALITY AND THAT WILL IMPROVE THE QUALITY OF THE MANUFACTURED PRODUCT. "
